沸点	196 ºC
闪点	67 ºC
密度	0.834

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Bismuth (III) Halides and Sulfate as Highly Efficient Catalyst for the Sulfenylation of Carbonyl and Related Compounds1Komatsu N, et al. Synlett, 1995(09), 984-986 (1995) Glass formation and properties of Ge-Te-BiI3 far infrared transmitting chalcohalide glasses.Jie Sun et al.Spectrochimica acta. Part A, Molecular and biomolecular spectroscopy, 79(5), 904-908 (2011-05-10) Spray pyrolysis deposition and photoelectrochemical properties of n-type BiOI nanoplatelet thin films.Nathan T Hahn et al.ACS nano, 6(9), 7712-7722 (2012-08-16) The first bismuth (III)-catalyzed guanylation of thioureasCunha S and Rodrigues Jr MT Tetrahedron Letters, 47(39), 6955-6956 (2006) Reversible dynamic isomerism change in the solid state, from Bi4I16 clusters to BiI4 1D chains in L-cystine based hybrids: templating effect of cations in iodobismuthate network formation.Wenhua Bi et al.Chemical communications (Cambridge, England), (44)(44), 5743-5745 (2008-11-15) Bismuth iodide impregnation of the peripheral nerve fibres.S Dolapchieva et al.Zeitschrift fur mikroskopisch-anatomische Forschung, 99(5), 804-812 (1985-01-01) Iodobismuthates with N-alkyl- or N,N'-dialkyl-4,4'-bipyridinium: syntheses, structures and dielectric properties.Yang Chen et al.Physical chemistry chemical physics : PCCP, 13(13), 5659-5667 (2011-02-12) Synthesis and characterization of aspartic acid complexes of antimony and bismuth triiodide.R R Jia et al.Amino acids, 31(1), 85-90 (2006-04-04) Environmentally friendly organic synthesis using bismuth compounds: bismuth (III) iodide catalyzed deprotection of acetals in waterBailey AD, et al. Tetrahedron Letters, 49(4), 691-694 (2008) Ion-pair formation of Bi(III)-iodide with some nitrogenous drugs and its application to pharmaceutical preparations.F M Abdel-Gawad Journal of pharmaceutical and biomedical analysis, 16(5), 793-799 (1998-04-16) Enhanced adsorption and photocatalytic activity of BiOI-MWCNT composites towards organic pollutants in aqueous solution.Minhua Su et al.Journal of hazardous materials, 229-230, 72-82 (2012-06-20)

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