Methiotepa | CAS:76-96-0
Methiotepa
- 名称:甲硫涕巴 | Methiotepa
- CAS号:76-96-0
- 别名:Metapside; Methiotepa; NSC 54055; NSC 56843; Tris(2-methyl-1-aziridinyl)phosphine sulfide
- 分子式:C9H18N3PS
- 分子量:231.30
- EINESC号:200-995-3
产品描述
物理化学性质
密度 | 1.30±0.1 g/cm3 (20 ºC |
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安全数据
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SDS
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同行评议文献
An improved method for the palladium-catalyzed amination of aryl iodides.M H Ali et al.The Journal of organic chemistry, 66(8), 2560-2565 (2001-04-17)
Recyclable and reusable nano-CuFe2O4 catalyzed CO cross-coupling.Avudoddi V, et al. European Journal of Organic Chemistry, 3(3), 298-304 (2012)
Recyclable and reusable nano-CuFe2O4 catalyzed CO cross-coupling. Avudoddi V, et al. European Journal of Chemistry, 3(3), 298-304 (2012)
Copper-catalyzed domino halide exchange-cyanation of aryl bromides.Jacopo Zanon et al.Journal of the American Chemical Society, 125(10), 2890-2891 (2003-03-06)
Biphenyl-3, 3', 5, 5'-tetracarboxylic acid.Coles SJ, et al. Acta Crystallographica Section E, Structure Reports Online, 58(6), 626-628 (2002)
An efficient copper-catalyzed coupling of aryl halides with imidazoles.Kiyomori A, et al. Tetrahedron Letters, 40(14), 2657-2660 (1999)
Copper-catalyzed halogen exchange in aryl halides: an aromatic Finkelstein reaction.Artis Klapars et al.Journal of the American Chemical Society, 124(50), 14844-14845 (2002-12-12)
On the synthesis of heterocyclic dendrons.Diez-Barra E, et al. ARKIVOC (Gainesville, FL, United States), 2002(5), 17-25 (2002)
Ligands for copper-catalyzed C-N bond forming reactions with 1 mol% CuBr as catalyst.Kai Yang et al.The Journal of organic chemistry, 76(9), 3151-3159 (2011-03-24)
A general, efficient, and inexpensive catalyst system for the coupling of aryl iodides and thiols.Fuk Yee Kwong et al.Organic letters, 4(20), 3517-3520 (2002-09-27)
Control of rotor function in light-driven molecular motors.Anouk S Lubbe et al.The Journal of organic chemistry, 76(21), 8599-8610 (2011-09-21)
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Products protected by valid patents are not offered for sale in countries where the sale of such products constitutes a patent infringement and its liability is at buyer's risk.
Products currently covered by valid US Patents are offered for R&D use in accordance with 35 USC 271 +A13(1).
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